Communication—Fabrication of a Uniformly Tin-Coated...

Communication—Fabrication of a Uniformly Tin-Coated Three-Dimensional Copper Nanostructured Architecture by Electrodeposition

Arai, Susumu, Mendsaikhan, Munkhbat, Nishimura, Koichi
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Volume:
163
Year:
2016
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/2.0831602jes
File:
PDF, 1.34 MB
english, 2016
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