[IEEE 2015 16th International Conference on Electronic...

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[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Achieving high reliability via pressureless sintering of nano-Ag paste for die-attach

Chen, Sihai, Fan, Guangyu, Yan, Xue, LaBarbera, Chris, Kresge, Lee, Lee, Ning-Cheng
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Year:
2015
Language:
english
DOI:
10.1109/ICEPT.2015.7236609
File:
PDF, 3.53 MB
english, 2015
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