Application of a diffusion bonding methodology to develop a...

Fusion Engineering and Design 2003 Vol. 66-68; Iss. none

Application of a diffusion bonding methodology to develop a Be/Cu HIP bond suitable for the ITER blanket

P. Sherlock, A. Erskine, P. Lorenzetto, A.T. Peacock
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Volume:
66-68
Year:
2003
Language:
english
Pages:
5
DOI:
10.1016/s0920-3796(03)00184-4
File:
PDF, 249 KB
english, 2003
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