Grouped through silicon vias for lower Ldi/dt drop in...

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Grouped through silicon vias for lower Ldi/dt drop in three-dimensional integrated circuit

Mossa, Siraj Fulum, Elkeelany, Omar Sayed Ahmed, Hasan, Syed Rafay
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Language:
english
Journal:
IET Circuits, Devices & Systems
DOI:
10.1049/iet-cds.2015.0065
Date:
January, 2015
File:
PDF, 818 KB
english, 2015
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