[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - The effects of rolling deformation on Al-27%Si alloys prepared by powder metallurgy for electronic packaging applications
Dai, Yilong, Yu, Kun, Teng, Fei, Xiong, Hanqing, Fan, SufengYear:
2015
Language:
english
DOI:
10.1109/ICEPT.2015.7236605
File:
PDF, 1.90 MB
english, 2015