Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging
Mustafa, Muhannad, Suhling, Jeffrey C., Lall, PradeepLanguage:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2015.10.021
Date:
October, 2015
File:
PDF, 5.53 MB
english, 2015