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[IEEE 2014 Symposium on Design, Test, Integration and...

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[IEEE 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Cannes, France (2014.4.1-2014.4.4)] 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Remote power feed and control of MEMS with 58 V silicon photovoltaic cell made by a CMOS post-process dry release and device isolation method

Mori, Isao, Kubota, Masanori, Lebrasseur, Eric, Mita, Yoshio
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Year:
2014
Language:
english
DOI:
10.1109/DTIP.2014.7056670
File:
PDF, 1.80 MB
english, 2014
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