[IEEE 2011 IEEE International 3D Systems Integration Conference (3DIC) - Osaka (2012.01.31-2012.02.2)] 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - Advanced TSV filling method with Sn alloy and its reliability
Ko, Young-Ki, Kang, Myong-Suk, Kokawa, Hiroyuki, Sato, Yutaka S., Yoo, Sehoon, Lee, Chang-WooYear:
2012
Language:
english
DOI:
10.1109/3DIC.2012.6262988
File:
PDF, 533 KB
english, 2012