[IEEE 2015 IEEE Aerospace Conference - Big Sky, MT (2015.3.7-2015.3.14)] 2015 IEEE Aerospace Conference - High temperature die-attach materials for aerospace power electronics: Lifetime tests and modeling
Hutzler, Aaron, Tokarski, Adam, Schletz, AndreasYear:
2015
Language:
english
DOI:
10.1109/AERO.2015.7118949
File:
PDF, 962 KB
english, 2015