A thermal, mechanical, and electrical study of voiding in the solder die-attach of power MOSFETs
Katsis, D.C., vanWyk, J.D.Volume:
29
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/TCAPT.2005.853301
Date:
March, 2006
File:
PDF, 2.22 MB
english, 2006