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Effect of nano Al2O3 particles doping on electromigration and mechanical properties of Sn–58Bi solder joints
Hu, Tianwei, Li, Yi, Chan, Yan-Cheong, Wu, FengshunVolume:
55
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2015.05.008
Date:
July, 2015
File:
PDF, 3.52 MB
english, 2015