[IEEE 2013 IEEE International 3D Systems Integration...

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[IEEE 2013 IEEE International 3D...

[IEEE 2013 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2013.10.2-2013.10.4)] 2013 IEEE International 3D Systems Integration Conference (3DIC) - Thermal correlation between measurements and FEM simulations in 3D ICs

Souare, P. M., de Crecy, F., Fiori, V., Ben Jamaa, H., Farcy, A., Gallois-Garreignot, S., Borbely, A., Colonna, J.-P., Coudrain, P., Giraud, B., Laviron, C., Cheramy, S., Tavernier, C., Michailos, J.

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Year:

2013

Language:

english

DOI:

10.1109/3DIC.2013.6702362

File:

PDF, 817 KB

english, 2013

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