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[IEEE 2015 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2015.8.31-2015.9.2)] 2015 International 3D Systems Integration Conference (3DIC) - New signal skew cancellation method for 2 Gbps transmission in glass and organic interposers to achieve 2.5D package employing next generation high bandwidth memory (HBM)
Kariyazaki, Shuuichi, Kuboyama, Kenichi, Oikawa, Ryuichi, Funaya, TakuoYear:
2015
Language:
english
DOI:
10.1109/3DIC.2015.7334556
File:
PDF, 1.80 MB
english, 2015