[IEEE 2015 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2015.8.31-2015.9.2)] 2015 International 3D Systems Integration Conference (3DIC) - Characterization of stress distribution in ultra-thinned DRAM wafer
Nakamura, Tomoji, Mizushima, Yoriko, Young Suk Kim,, Sugie, Ryuichi, Ohba, TakayukiYear:
2015
Language:
english
DOI:
10.1109/3DIC.2015.7334558
File:
PDF, 2.18 MB
english, 2015