Fabrication and characterization of vias for contacting YBa2Cu3O7−x multilayers
J.W. Cooksey, S. Afonso, W.D. Brown, L.W. Schaper, S.S. Ang, R.K. Ulrich, G.J. Salamo, F.T. ChanVolume:
282-287
Year:
1997
Language:
english
Pages:
2
DOI:
10.1016/s0921-4534(97)00495-4
File:
PDF, 219 KB
english, 1997