Microstructural evolution, microhardness and thermal...

Materials Science and Engineering: A 2000 Vol. 290; Iss. 1-2

Microstructural evolution, microhardness and thermal stability of HPT-processed Cu

Honggang Jiang, Y.Theodore Zhu, Darryl P Butt, Igor V Alexandrov, Terry C Lowe
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Volume:
290
Year:
2000
Language:
english
Pages:
11
DOI:
10.1016/s0921-5093(00)00919-9
File:
PDF, 528 KB
english, 2000
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