The microstructure and the thermal expansion...

The microstructure and the thermal expansion characteristics of Cu/SiCp composites

Kuen-Ming Shu, G.C Tu
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Volume:
349
Year:
2003
Language:
english
Pages:
12
DOI:
10.1016/s0921-5093(02)00788-8
File:
PDF, 529 KB
english, 2003
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