Ti/Ni/Au contacts to n-SiC after low energy implantation

Materials Letters 2016 / 03 Vol. 166

Ti/Ni/Au contacts to n-SiC after low energy implantation

Leech, Patrick W, Holland, Anthony S, Reeves, Geoffrey K, Pan, Yue, Ridgway, Mark, Tanner, Phillip
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Volume:
166
Language:
english
Journal:
Materials Letters
DOI:
10.1016/j.matlet.2015.12.036
Date:
March, 2016
File:
PDF, 471 KB
english, 2016
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