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[IEEE 2014 Electronics System-Integration Technology Conference (ESTC) - Helsinki, Finland (2014.9.16-2014.9.18)] Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) - Relationship between bonding conditions and strength for joints using a Au nanoporous sheet
Matsunaga, Kaori, Kim, Min-Su, Nishikawa, Hiroshi, Saito, Mikiko, Mizuno, JunYear:
2014
Language:
english
DOI:
10.1109/ESTC.2014.6962855
File:
PDF, 1.43 MB
english, 2014