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Properties of electroplated copper thin film and its interfacial reactions in the EPCu/IMPCu/IMPTaN/SiO2/Si multilayer structure
Khin Maung Latt, Kangsoo Lee, Thomas Osipowicz, Y.K LeeVolume:
83
Year:
2001
Language:
english
Pages:
7
DOI:
10.1016/s0921-5107(00)00544-4
File:
PDF, 515 KB
english, 2001