Analysis of Ohmic Losses Due to Solder and Pressure...

Energy Procedia 2015 / 08 Vol. 77

Analysis of Ohmic Losses Due to Solder and Pressure Interconnection and Related Interface Resistances for Solar Cells

Urban, Tobias, Heimann, Matthias, Schmid, Alexander, Mette, Ansgar, Heitmann, Johannes
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Volume:
77
Language:
english
Journal:
Energy Procedia
DOI:
10.1016/j.egypro.2015.07.059
Date:
August, 2015
File:
PDF, 633 KB
english, 2015
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