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Microstructure and mechanical properties of Pb-free Sn–3.0Ag–0.5Cu solder pastes added with NiO nanoparticles after reflow soldering process
Chellvarajoo, Srivalli, Abdullah, M.Z.Volume:
90
Language:
english
Journal:
Materials & Design
DOI:
10.1016/j.matdes.2015.10.142
Date:
January, 2016
File:
PDF, 2.78 MB
english, 2016