[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Effect of 0.8 wt% Al2O3 nanoparticles addition on the microstructures and electromigration behavior of Sn-Ag-Cu solder joint
Peng, Hao, Huang, Bomin, Chen, Guang, Wu, Fengshun, Liu, Hui, Chan, YCYear:
2015
Language:
english
DOI:
10.1109/icept.2015.7236751
File:
PDF, 1.01 MB
english, 2015