UV-LIGA process for high aspect ratio structure using stress barrier and C-shaped etch hole
Hyun-Kee Chang, Yong-Kweon KimVolume:
84
Year:
2000
Language:
english
Pages:
9
DOI:
10.1016/s0924-4247(00)00408-8
File:
PDF, 3.26 MB
english, 2000