Characterization of silicon wafer bonding for Power MEMS...

Characterization of silicon wafer bonding for Power MEMS applications

Arturo A. Ayón, Xin Zhang, Kevin T. Turner, Dongwon Choi, Bruno Miller, Steven F. Nagle, S.Mark Spearing
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Volume:
103
Year:
2003
Language:
english
Pages:
8
DOI:
10.1016/s0924-4247(02)00329-1
File:
PDF, 621 KB
english, 2003
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