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Studies on SiO2–SiO2 bonding with hydrofluoric acid. Room temperature and low stress bonding technique for MEMS
H Nakanishi, T Nishimoto, R Nakamura, A Yotsumoto, T Yoshida, S ShojiVolume:
79
Year:
2000
Language:
english
Pages:
8
DOI:
10.1016/s0924-4247(99)00246-0
File:
PDF, 1.19 MB
english, 2000