[IEEE 2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT) - Guilin, China (2014.10.28-2014.10.31)] 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Thermal analysis and thermal optimization of through silicon via in 3D IC
Fu, Jingyan, Hou, Ligang, Lu, Bo, Wang, JinhuiYear:
2014
Language:
english
DOI:
10.1109/ICSICT.2014.7021445
File:
PDF, 589 KB
english, 2014