[IEEE 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Hsinchu (2015.6.29-2015.7.2)] 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits - 2.5D/3D device package level defect localization with the use of multiple curve tracings and repeated thermal emission analyses
Lee Lan Yin,, Chua Kok Keng,, Tan, GraceYear:
2015
Language:
english
DOI:
10.1109/IPFA.2015.7224399
File:
PDF, 853 KB
english, 2015