Microcontact-Enhanced Thermoelectric Cooling of Ultrahigh...

IEEE Transactions on Components Packaging and Manufacturing Technology 2015 / 12 Vol. 5; Iss. 12

Microcontact-Enhanced Thermoelectric Cooling of Ultrahigh Heat Flux Hotspots

Manno, Michael, Yang, Bao, Khanna, Sumeer, McCluskey, Patrick, Bar-Cohen, Avram
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Volume:
5
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2015.2495350
Date:
December, 2015
File:
PDF, 1.03 MB
english, 2015
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