Flexible electronics under strain: a review of mechanical...

Journal of Materials Science 2016 / 3 Vol. 51; Iss. 6

Flexible electronics under strain: a review of mechanical characterization and durability enhancement strategies

Harris, K. D., Elias, A. L., Chung, H.-J.
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Volume:
51
Language:
english
Journal:
Journal of Materials Science
DOI:
10.1007/s10853-015-9643-3
Date:
March, 2016
File:
PDF, 3.90 MB
english, 2016
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