[IEEE 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Hsinchu (2015.6.29-2015.7.2)] 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits - Study of thermal cycling and temperature aging on PbSnAg die attach solder joints for high power modules
Dugal, F., Ciappa, M.Year:
2015
Language:
english
DOI:
10.1109/IPFA.2015.7224318
File:
PDF, 112 KB
english, 2015