A Simplified Conduction Based Modeling Scheme for Design...

A Simplified Conduction Based Modeling Scheme for Design Sensitivity Study of Thermal Solution Utilizing Heat Pipe and Vapor Chamber Technology

Prasher, Ravi S.
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Volume:
125
Year:
2003
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1602479
File:
PDF, 616 KB
english, 2003
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