Low thermal budget photonic processing of highly conductive Cu interconnects based on CuO nanoinks: Potential for flexible printed electronics
Rager, Matthew S, Aytug, Tolga, Veith, Gabriel M., Joshi, PooranLanguage:
english
Journal:
ACS Applied Materials & Interfaces
DOI:
10.1021/acsami.5b12156
Date:
December, 2015
File:
PDF, 3.36 MB
english, 2015