Integration of CNTs in 3D-IC interconnects: a non-destructive approach for the precise characterization and elucidation of interfacial properties
Ghosh, K., Verma, Y. K., Tan, C. S.Volume:
3
Year:
2015
Language:
english
Journal:
J. Mater. Chem. A
DOI:
10.1039/C4TA04715J
File:
PDF, 813 KB
english, 2015