Microstructural Evolution and Mechanical Properties of...

Journal of Electronic Materials 2016 / 1 Vol. 45; Iss. 1

Microstructural Evolution and Mechanical Properties of Au-20wt.%Sn|Ni Interconnection

Dong, H.Q., Vuorinen, V., Liu, X.W., Laurila, T., Li, J., Paulasto-Kröckel, M.
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Volume:
45
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-015-4152-3
Date:
January, 2016
File:
PDF, 1.96 MB
english, 2016
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