Effects of Cooling Rate on the Microstructure and...

Journal of Electronic Materials 2016 / 1 Vol. 45; Iss. 1

Effects of Cooling Rate on the Microstructure and Morphology of Sn-3.0Ag-0.5Cu Solder

Lee, Hwa-Teng, Huang, Kuo-Chen
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
45
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-015-4189-3
Date:
January, 2016
File:
PDF, 7.38 MB
english, 2016
Conversion to is in progress
Conversion to is failed