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[IEEE 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2015.10.21-2015.10.23)] 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Via-interconnect ball-grid-array (ViB) fabricated by die-middle PCB-like process
Lu, Charlie, Tien, H.K., Lin, J.C., Lee, Kidd, Shih, PieYear:
2015
Language:
english
DOI:
10.1109/IMPACT.2015.7365199
File:
PDF, 1.09 MB
english, 2015