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Rack Level Modeling of Air Flow Through Perforated Tile in a Data Center
Arghode, Vaibhav K., Kumar, Pramod, Joshi, Yogendra, Weiss, Thomas, Meyer, GaryVolume:
135
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4024994
Date:
July, 2013
File:
PDF, 3.31 MB
english, 2013