[IEEE 2014 International Conference on Planarization/CMP Technology (ICPT) - Kobe, Japan (2014.11.19-2014.11.21)] Proceedings of International Conference on Planarization/CMP Technology 2014 - Development of the post-chemical mechanical polishing cleaner suppressing galvanic corrosion between copper and the Co barrier metal
Kusano, Tomohiro, Shibata, Toshiaki, Itou, Atsushi, Mizutani, FumikazuYear:
2014
Language:
english
DOI:
10.1109/icpt.2014.7017264
File:
PDF, 123 KB
english, 2014