[IEEE 2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) - Chicago, IL, USA (2015.5.3-2015.5.6)] 2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) - Embedding active and passive components in PCBs and inorganic substrates for power electronics
Parker, Ernie, Narveson, Brian, Alderman, Arnold, Burgyan, LouisYear:
2015
Language:
english
DOI:
10.1109/IWIPP.2015.7295990
File:
PDF, 3.08 MB
english, 2015