[ASME ASME 2013 International Mechanical Engineering Congress and Exposition - San Diego, California, USA (Friday 15 November 2013)] Volume 10: Micro- and Nano-Systems Engineering and Packaging - Chip Package Co-Design: Effect of Substrate Warpage on BEOL Reliability
Raghavan, Sathyanarayanan, Schmadlak, Ilko, Leal, George, Sitaraman, SureshYear:
2013
Language:
english
DOI:
10.1115/IMECE2013-65877
File:
PDF, 1.01 MB
english, 2013