[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales - Effects of Low CTE Materials on Thermal Deformation of Organic Substrates in Flip Chip Package Application
Mori, Hiroyuki, Kohara, Sayuri, Okamoto, Keishi, Noma, Hirokazu, Toriyama, KazushigeYear:
2015
Language:
english
DOI:
10.1115/IPACK2015-48741
File:
PDF, 2.71 MB
english, 2015