![](/img/cover-not-exists.png)
[IEEE 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Kyoto, Japan (2015.4.14-2015.4.17)] 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Small-footprint 128-Gb/s DP-QPSK silicon optical modulator in ceramic-based metal package with low optical coupling loss
Ishihara, Hiroki, Mashiko, Yasuhiro, Goi, Kazuhiro, Ogawa, Kensuke, Liow, Tsung-Yang, Tu, Xiaoguang, Lo, Guo-Qiang, Kwong, Dim-LeeYear:
2015
Language:
english
DOI:
10.1109/ICEP-IAAC.2015.7111095
File:
PDF, 1.65 MB
english, 2015