3-D Embedded Packaging Technology: Analyzing its needs and...

IEEE Power Electronics Magazine 2015 / 12 Vol. 2; Iss. 4

3-D Embedded Packaging Technology: Analyzing its needs and challenges

Alderman, Arnold, Burgyan, Lajos Louis, Narveson, Brian, Parker, Ernie
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Volume:
2
Language:
english
Journal:
IEEE Power Electronics Magazine
DOI:
10.1109/MPEL.2015.2485359
Date:
December, 2015
File:
PDF, 3.11 MB
english, 2015
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