Advances in the Fabrication Processes and Applications of Wafer Level Packaging
Liu, Peisheng, Wang, Jinlan, Tong, Liangyu, Tao, YujuanVolume:
136
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4027397
Date:
April, 2014
File:
PDF, 1.71 MB
english, 2014