Reliability Assessment of Wafer Level Packages With Novel FeNi Under Bump Metallization
Xi, Jia, Zhai, Xinduo, Wang, Jun, Yang, Donglun, Ru, Mao, Xiao, Fei, Zhang, Li, Ming Lai, ChiVolume:
137
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4030974
Date:
July, 2015
File:
PDF, 2.97 MB
english, 2015