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[IEEE International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (11-14 March 2001)] Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) - Photosensitive polynorbornene as a dielectric material for packaging applications
Yiqun Bai,, Chiniwalla, P., Kohl, P.A., Bidstrup-Allen, S.A.Year:
2001
Language:
english
DOI:
10.1109/ISAOM.2001.916596
File:
PDF, 407 KB
english, 2001