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SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California, United States (Sunday 22 February 2015)] Advances in Patterning Materials and Processes XXXII - Aqueous-based thick photoresist removal for bumping applications
Wallow, Thomas I., Hohle, Christoph K., Moore, John C., Brewer, Alex J., Law, Alman, Pettit, Jared M.Volume:
9425
Year:
2015
Language:
english
DOI:
10.1117/12.2175826
File:
PDF, 3.21 MB
english, 2015