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Stamp degradation for high volume UV enhanced substrate conformal imprint lithography (UV-SCIL)
Haslinger, M.J., Verschuuren, M.A., van Brakel, R., Danzberger, J., Bergmair, I., Mühlberger, M.Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2016.01.018
Date:
January, 2016
File:
PDF, 697 KB
english, 2016