The Effects of Humidity on Tin Whisker Growth by Immersion Tin Plating and Tin Solder Dipping Surface Finishes
Lim, Hooi Peng, Ourdjini, Ali, Bakar, Tuty Asma Abu, Tesfamichael, TuquaboVolume:
2
Year:
2015
Language:
english
Journal:
Procedia Manufacturing
DOI:
10.1016/j.promfg.2015.07.048
File:
PDF, 628 KB
english, 2015